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Home
About Us
Company Profile
Team Introduction
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Resources
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NEW!
Downloads
Glossaries
Octopart.com
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Contact Us
Home
About Us
Company Profile
Team Introduction
Certifications
Career Opportunities
Product & Services
Hardware Development & Prototyping
PCB Layout
PCB Fabrication
PCB Assembly
Electronic Component Sourcing
Plastic Molding
Resources
Capabilities
FAQs
Blogs
NEW!
Downloads
Glossaries
Octopart.com
Solutions
Contact Us
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HW Development & Prototype RFQ
PCB Layout RFQ
PCB Fabrication RFQ
PCB Assembly RFQ
Electronic Part Sourcing RFQ
Plastic Molding RFQ
HW Development & Prototype
PCB Layout
PCB Fabrication
PCB Assembly
Electronic Part Sourcing
Plastic Molding
Hardware Development & Prototyping Request for Quote
RFQ Form Number
Project background(Why does this project exist? Who will be the end user of the product? etc.)
(Required)
Is this project a POC(Proof of concept) prototype?
(Required)
Yes
No
Is this project brand new(version V01)?
(Required)
Yes
No
Untitled
(Required)
V02
V03
V04
Have you done a complete market research? And what is the market demand?
(Required)
Do you have the reliable resellers and or distributors for the new product?
(Required)
Would you mind introducing you and or your team’s career background (Electronics, Mechanical, Industrial, Software, Marketing, Others) ？ "
(Required)
Your budget?(USD)
(Required)
Your time frame?(Months)
(Required)
Attachments function
Drop files here or
Select files
Max. file size: 512 MB, Max. files: 10.
Design technical SPECs & requirements
(Required)
Name
(Required)
First
Last
Email
(Required)
PCB layout Request for Quote
RFQ Form Number
Project background(Why does this project exist )
(Required)
Attachments function
Drop files here or
Select files
Max. file size: 512 MB, Max. files: 10.
Design technical SPECs & requirements
(Required)
Unit Price
Board type by layer count
Reference Price(X$/Pin)
Single -layer board
1.5
Two -layer board
1
Four -layer board
1.25
Six -layer board
1.5
Eight -layer board
1.8
Ten -layer board
2
Ten+ -layer board
Case by Case
Design unit price subject to float up or down depends on the number of supportance,density of the board, and product type. When the Contract established, the deposit of 50% must be paid; the balance paid before Gerber Out If the Placement has been started, and the implementation of the project is ended due to customer factors, 20%will be collected. If the Placement has been performed, and the implementation of the project is ended due to customer factors, 50%will be collected. If the Layout has been performed by 50%, and the implementation of the project is ended due to customer factors, 80%will be collected. If the Layout has been performed by 70%, and the implementation of the project is ended due to customer factors, the full amount will be collected. The modification scale is within 30%=>Charging as per time: $30/H (original design case); $60/H (non -original design case). The modification scale is greater than 30%=> Calculated based on the percentage of the new case. The minimum fee of the case: $300/case; COB/Blind Via/Buried Via/Non-45-degree Line/Limited Heights of more than 5 area, etc. The charges is subjected to change.
I agree to the terms & conditions
Design unit price subject to float up or down depends on the number of supportance,density of the board, and product type.
When the Contract established, the deposit of 50% must be paid; the balance paid before Gerber Out
If the Placement has been started, and the implementation of the project is ended due to customer factors, 20%will be collected.
If the Placement has been performed, and the implementation of the project is ended due to customer factors, 50%will be collected.
If the Layout has been performed by 50%, and the implementation of the project is ended due to customer factors, 80%will be collected.
If the Layout has been performed by 70%, and the implementation of the project is ended due to customer factors, the full amount will be collected.
The modification scale is within 30%=>Charging as per time: $30/H (original design case); $60/H (non -original design case). The modification scale is greater than 30%=> Calculated based on the percentage of the new case.
The minimum fee of the case: $300/case;
COB/Blind Via/Buried Via/Non-45-degree Line/Limited Heights of more than 5 area, etc. The charges is subjected to change.
Name
(Required)
First
Last
Email
(Required)
PCB Fabrication Request for Quote
RFQ Type
Advanced Process
Typical Process
As per the PCB design technology and the manufacturing process, our PCB fabrication services are divided into two types: The first category is what we call “Typical process”. It means we can offer Small Quantity – Quick Turn PCBs, Custom Spec – Standard PCBs, Quick-order PCB.
The second is our “Advanced process” offering. This shows the very high end PCB fabrication service that PCBLOOP can offer:Full Spec PCBs, Highly Specialized Precision PCBs, & Large Scale Production.
Advanced Process
Typical Process
Customer Part Number
Your unique nomenclature assignment,(XXXXXX means Year Month Day,YYY means serial number under this type)
FINAL UNIT PRICE
(USD)
Revision
(Required)
Your letter or number
Quantities
(Required)
List the number of individual board quantities to be quoted. Do not use array quantity,N
Layer Count
(Required)
1
2
4
6
8
10
12
Layer Count
(Required)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
X Dimension
(Required)
In inches, the most extreme measurement in the X axis of the individual PCB,0.5×0.5″< X<157.5x197"(400x500mm)
Y Dimension
(Required)
In inches, the most extreme measurement in the Y axis of the individual PCB,0.5×0.5″< Y<157.5x197"(400x500mm)
Array
(Required)
Yes
No
Panelization configuration of individual PCBs to be tab routed or scored
Array X Dimension
(Required)
In inches, the most extreme array measurement in the X axis, including any rails or borders,<157.5x197"(400x500mm)
Array Y Dimension
(Required)
In inches, the most extreme array measurement in the Y axis, including any rails or borders,<157.5x197"(400x500mm)
Tab-Rout
(Required)
Tabs routed between each PCB for break-a-way. Unless otherwise noted, we use 100 mil spacing between boards
Scoring
(Required)
V-groove cut into both the top and bottom of the boards for break-a-way
Material Type
Different types of laminate available for PCB fabrication
Finish Thickness:
The total thickness of the board including all plating and final finishes
Copper Weight (Outer)
Number of ounces of copper per square foot on outer layers. Specify this as “finished” copper weight
Copper Weight (Inner)
Copper thickness required on inner layer cores, typically 0.5 oz
Min. Trace/Space:
Minimum trace width and spacing
Soldermask
LPI: Liquid Photo Imageable mask
Soldermask Color
Color of mask used to cover the PCB
Smallest Hole Size
Smallest finished hole in mils
Silkscreen Color
Color of ink printed on the board typically white
Finish Plating
Lead Free Solder
Yes
N/A
Tin/copper solder application
Leaded Solder
Yes
N/A
63/37 Tin/lead solder application
Deep Gold
Yes
N/A
Electrolytic gold plating finish
Selective Gold
Yes
N/A
Electrolytic gold plating on selected pads
Bare Copper
Yes
N/A
No plating finishes – an atypical request
Immersion Gold
Yes
N/A
3-10 microinches of gold over electroless nickel (ENIG)
Immersion Tin
Yes
N/A
1-5 microinches of tin (White Tin)
OSP
Yes
N/A
Organic Surface Protectant
Flash Gold
Yes
N/A
1-3 microinches of electrolytic gold
Soft Gold
Yes
N/A
99% pure, 30-100 microinches of gold (Wire Bondable Gold)
Carbon Ink
Yes
N/A
Conductive carbon paste selectively applied
Immersion Silver
Yes
N/A
12-15 microinches of silver
Gold Fingers
Yes
N/A
Select the number of gold finger edges where “edge” is defined not as top or bottom but a side of the board. We bevel gold fingers unless otherwise specified. We do NOT bevel solder fingers unless specified by customer. Our standard bevel is 30 degrees leaving a .030″ edge (+/-.005″) on a .062″ board. Optional bevels are as follows:
45 degrees leaving .025″ edge (+/-.005″)
20 degrees leaving .071″ edge (+/-.005″)
Top SMD Pads
Yes
N/A
Number of Surface Mount Device pads on top side
Bottom SMD Pads
Yes
N/A
Number of Surface Mount Device pads on bottom
TOP SMD
Bottom SMD
Minimum Pitch
Yes
N/A
The minimum distance between pad centers
Plated Slots
Yes
N/A
Elongated holes used for component placement plated with copper
Minimum Pitch Number
Plated Edges
Yes
N/A
Edges of the board itself plated with copper
Controlled Dielectric
Yes
N/A
Specified thickness of the insulating layers between a signal and power or ground planes
Counterbore:
Yes
N/A
A cylindrical recess, machined around a hole to allow a screw head to sit flush with a surface, plated or non-plated.
Countersink
Yes
N/A
A beveled recess, machined around a hole to allow a screw head to sit flush with a surface, plated or non-plated.
Controlled Impedance:
Yes
N/A
Matching material properties with trace dimensions and locations to create specific electric impedance for a signal
ITAR
Yes
N/A
“International Traffic in Arms Regulations” which govern the export of weapons and weapons-related technology from the United States. Please indicate whether your board design data is ITAR-controlled or not. Go to https://www.pmddtc.state.gov/regulations_laws/itar.html for more info
Class 3
Yes
N/A
High Reliability Electronic Products where continued operation or performance on demand is critical. (i.e.. Flight controls or life support)
Etchback
Yes
N/A
On high reliability boards a process called etch-back is performed chemically with a potassium permanganate based etchant or plasma. The etch-back removes resin and the glass fibers so that the copper layers extend into the hole and as the hole is plated become integral with the deposited copper.
Castellated holes
Yes
N/A
Plated or non-plated edge of the board that includes a portion of each of a series of drilled holes.
Buried Via
Yes
N/A
A via that does not extend to the surface of the board.
Blind Via
Yes
N/A
A via extending to only one surface layer of the board
Microvia
Yes
N/A
A blind or buried plated hole that is less than or equal to 0.006″ in diameter.
Via-In-Pad
Yes
N/A
Via in pad (VIP) is best defined as a via hole (either through hole or blind/buried) that is first drilled and copper plated then filled with a conductive (typically DuPont CB100) or non-conductive (typically San-Ei Kagaku PHP900 or Peters PP2795) epoxy plug ink/paste and finally cured to a hardened state. The fill material is planarized to create a flat surface across the PCB panel and then plated over with copper. After this step the final through holes are drilled or subsequent laminations (blind/buried vias) are done. In most applications these now “invisible holes” are used for solderable pads in SMT and BGA applications.
Filled/Plugged Vias
Yes
N/A
A filled via has material applied into the hole with the intent of full penetration and encapsulation of the hole. A plugged via has material applied with the intent of only partially penetrating the hole from one or both sides of the board.
Holes Plated .0015”
Yes
N/A
Requirement to have a minimum of .0015” (38um) copper plated on the hole walls. This requirement is greater than that called out in IPC-6012-2010 (18um for Class 1,2 and 20um for Class 3). Typically specified in high reliability and/or high current applications.
Cores < .004”
Yes
N/A
Requirement in controlled dielectric or controlled impedance applications for cores that are less than .004”. These may require special handling and processing.
Cover Coat
Yes
N/A
Layer of dielectric that covers the surface (one or both sides) of the board. This can be used when the boards need to be insulated from adjacent conductive surfaces (i.e. heat sinks) or in very high voltage applications.
Cavity Process
Yes
N/A
Process that allows for portions on the inner-layers to be exposed. The exposed areas may have a surface finish and soldermask applied if required. Typically if there are holes within these areas they will need to be plugged and capped with copper, if possible avoid holes within the exposed areas.
Controlled Depth Drilling
Yes
N/A
Process for drilling partially though the thickness of the boards.
Back Drilling
Yes
N/A
The process of removing the unused portion “stub” of vias by drilling a larger hole from one or both sides after the plating processes. This is typically required in very high speed applications (10GHz or greater) to minimize the parasitic effects of the via stubs.
Pem Nuts
Yes
N/A
Inserts that are either friction-fit or swaged into holes that contain internal threading for mechanical fastening.
LPI Legend
Yes
N/A
Liquid Photo Imageable legend. Alternate to silkscreened or ink jetted legend when high resolution of small features is required.
Edge Mill
Yes
N/A
Process used to reduce the thickness of the material along the board edges. Typically required when a thicker board is required to slide into card guides.
Laser Rout
Yes
N/A
The utilization of Laser ablation to remove the boards for the production panel of to create internal cutouts. Typically required when the radius of mechanical milling tools too large to form the required profile. May also be required for some materials.
Unique Serialization:
Yes
N/A
The requirement for a specific number format or number range when the boards are serialized.
Tetra Etch
Yes
N/A
Process for preparing the surface and hole walls of PTFE materials for the plating processes. Tetra-Etch® is a trademark of W.L. Gore & Associates
Attachments function
Drop files here or
Select files
Max. file size: 512 MB, Max. files: 10.
Other Special Request
(Required)
Name
(Required)
First
Last
Email
(Required)
PCB assembly Request for Quote
RFQ Form Number
Project background(What type of product is this? Who will be the end user of the product? )
(Required)
Service Type
(Required)
Consigned/kitted
Partial Turn-key/Combo
Turn-key
PCBA Quantity
(Required)
PCB SPECs
Dimension
(Required)
(inches)
Layer Count
(Required)
Material Type
(Required)
Finish Thickness
(Required)
Copper Weight(Outer/Inner)
(Required)
Soldermask Color
(Required)
Silkscreen Color
(Required)
Finish Plating
(Required)
Attachments function
Drop files here or
Select files
Max. file size: 512 MB, Max. files: 10.
Other Special Request
(Required)
Name
(Required)
First
Last
Email
(Required)
Electronic Part Sourcing Request for Quote
RFQ Form Number
Project background(What type of product is this? Who will be the end user of the product? )
(Required)
What lead time do you require?
(Required)
Attachments function
Drop files here or
Select files
Max. file size: 512 MB, Max. files: 10.
Other special request
(Required)
Name
(Required)
First
Last
Email
(Required)
Plastic Molding Request for Quote
RFQ Form Number
Quantity
Expected Annual Volumes
Design Units
Material
Color
Material Additives
SPI Finish
Tool Requirements
Tolerance
Part Marking
What lead time do you require?
Attachments function
Max. file size: 50 MB.
(3D CAD: *.step, *.stp, *.x_t , *.iges, *.sldprt )
Other Special Request
Name
(Required)
First
Last
Email
(Required)
Fill Form to Download File
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(Required)
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(Required)
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